The overall goal of this project is to develop and test (in-vivo) a chronically implantable neural recording array and provide the device to the neuroscience community upon completion of the initial technical development phase for experimental use and evaluation.

In order to accomplish this task, existing and new technologies are being merged. The chronic recording array will consist of a high density flip-chip integrated stack of modules: a thinned Utah Electrode Array (UEA), a CMOS based signal processor (low noise amplifier, peak detector) and communications module (forward and reverse telemetry link, RF module) and a high efficiency thin film coil for inductive power coupling. Silicon carbide and Parylene are intended for use as hermetic encapsulating material.

Device Fabrication
Electrode tip metalization
Waferscale processes
Signal processing ASIC
Power coil
System integration

Device Testing
Testing fully integrated wireless device
In vivo testing stage I
In vivo testing stage II

Schematic of fully integrated neural interface device

This work is being supported by NIH/NINDS (Contract No. HHSN265200423621C).